The ASRock AMD Radeon RX 6650 XT Challenger D 8GB OC is here to deliver the performance you deserve, boasting the latest PCI-e 4.0 support, dual striped axial fan cooling solution, a stylish metal backplate and 0dB silent cooling technology with ultra-fit heatpipes, to ensure you can consistently reach the top tier performance required to climb those leaderboards.
Specifications
- Base Clock: 2106MHz
- Boost Clock: 2669MHz
- Memory: 8GB 17500MHz GDDR6
- Stream Processors: 2048
- Recommended PSU: 550W
- Form Factor: 2 Slots
- Dimensions: 269 x 132 x 41 mm
- AMD RDNA 2 Gaming Architecture
- PCI Express 4.0 Support
- Dual Fan Design
- Striped Axial Fan
- Ultra-fit Heatpipe
- Stylish Metal Backplate
- 0dB Silent Cooling
2106MHz
Base Clock
2669MHz
Boost Clock
8GB
GDDR6 Memory
2048
Stream Processors
About the ASRock AMD Radeon RX 6650 XT Challenger D 8GB OC Graphics Card
Dual Fan Design
Two fans that provide strong cooling performance and make your gaming rig stay cool. It’s optimised for delivering excellent gaming experience with stylish and streamlined design.
Stylish Metal Backplate
Designed to avoid PCB bending. The fancy outlook makes the ASRock AMD Radeon RX 6650 XT Challenger D 8GB OC graphic card more legendary in visual. It also helps to enhance cooling with the premium thermal pads equipped backside.
Striped Axial Fan
ASRock’s custom Striped Axial Fan delivers enhanced airflow to optimise cooling from not only the stripe structure on each fan blade but also the polishing surface on the bottom side.
Ultra-fit Heatpipe
The heatpipes are consolidated to maximise the contact among each others and also the GPU baseplate for the optimised heat dissipation.
0dB Silent Cooling
The fan spins when the temperature goes high for the optimal cooling, and stops when the temperature goes low for the complete silence.
Premium Thermal Pad
The premium thermal pad helps to transfer the heat of the components to the heatsink, improving heat dissipation.
Nano Thermal Paste
Eliminate the gaps in the contact area to maximise heat transfer and thermal efficiency.