MSI NVIDIA GeForce RTX 4070 VENTUS 3X E OC 12G GDDR6X Graphics Card
- Boost Clock: 2505MHz (2520MHz OC Mode)
- CUDA Cores: 5888
- Power Consumption: 200W
- Recommended PSU: 650W
- Dimensions: 308 x 120 x 43 mm
£573.99
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Product Description
The MSI NVIDIA GeForce RTX 4070 VENTUS 3X E OC 12G brings a fundamentally solid experience to users looking for a performance graphics card. A sharp-looking updated design with TORX FAN 4.0 and Airflow Control lets VENTUS breeze through any task.
Specifications
- Base Clock: 1920MHz
- Boost Clock: 2505MHz (2520MHz OC Mode)
- Memory: 12GB 21000MHz GDDR6X
- CUDA Cores: 5888
- Power Consumption: 200W
- Recommended PSU: 650W
- Form Factor: 2 Slots
- Dimensions: 308 x 120 x 43 mm
- NVIDIA Ada Lovelace architecture
- 4th Generation Tensor Cores
- 3rd Generation RT Cores
- Triple Fan Thermal Design
- TORX Fan 4.0
- Zero Frozr
- Airflow Control
- MSI Center
1920MHz
Base Clock
2505MHz
Boost Clock
12GB
GDDR6X Memory
5888
CUDA Cores
About the MSI NVIDIA GeForce RTX 4070 VENTUS 3X E OC Graphics Card
Core Pipes
Core Pipes are precision-crafted to make maximum use of the available space. A squared section of heat pipes fully touch the GPU baseplate to then spread heat along the full length of the heatsink.
Copper Baseplate
Heat from the MSI NVIDIA GeForce RTX 4070 VENTUS 3X E OC GPU and memory modules is immediately captured by a solid nickel-plated copper baseplate and then rapidly transferred to an array of heat pipes. This widening of the thermal transfer systems with highly efficient mechanisms improves overall efficiency.
TORX FAN 4.0
TORX FAN 4.0 is built on teamwork, with pairs of fan blades bound together with a linked outer ring design that focuses airflow into the Triple-Fan cooling system.
Reinforcing Backplate
The reinforcing backplate features a flow-through design that provides additional ventilation.
Airflow Control
Stay stealthy with Airflow Control which improves airflow dynamics. Deflectors provide additional surface area and guide air to where it’s needed for maximum cooling.
Effective Thermal Padding
An abundance of clay-based thermal pads provide additional heat dissipation for board components.
DrMos
DrMOS power stage solutions provide great efficiency with low power loss and enhanced voltage controls.
Product Specifications
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